Concepts and Needs for Low Dielectric Constant <0.15µm Interconnect Materials: Now and the Next Millennium (Low K Program)

November 14-17, 1999
Seaside, California

Invitation & General Information

The Division of Polymer Chemistry of the American Chemical Society is offering an interdisciplinary workshop entitled, "Concepts and Needs for Low Dielectric Constant <0.15µm Interconnect Materials: Now and the Next Millennium". It will be held at the Embassy Suites on the Monterey Bay, California, on November 14-17, 1999. The workshop will offer invited lectures where scientists will have the opportunity to present their latest results in this field, while at the same time they will learn what the industry wants and needs. The meeting will provide a forum where industry leaders and decision makers can get together to describe what they see as the needs and challenges for low k interconnects, in particular the need for materials and manufacturing process for future <0.15µm-scale devices. In this way, the two most important players in this field will be brought together to discuss strategies for development of low k interconnects. The invited speaker list includes scientists from the US as well as from abroad.

The workshop is designed to be accessible to scientists responsible for synthesis and design of new materials, chemical manufacturers interested in designing/providing materials for Low k interconnect, engineers/technicians responsible for integrating materials into manufacturing processes, and business leaders concerned with strategies that allow them to remain competitive in this rapidly changing area. Additionally, the speakers will be available to discuss issues of interest with the participants during the workshop, especially during the poster session.

Poster Session

Poster sessions are planned in order to give the conferees the opportunity to present their innovative efforts in low k materials development and process integration.

Further information regarding the organizational aspects of the meeting, poster presentations and program can be obtained from the chairs.

Exhibitions

While the focus of the meeting is the discussion of issues pertaining to Low k, we are also providing exhibition space for companies interested in the Low k arena. We are able to offer space at a discounted cost of $500 for a table in our Exhibition Room. All exhibitors must also register as meeting participants. Parties interested in obtaining Exhibition space during the Workshop should first contact the organizers, Kenneth Carter or Devendra Kumar. Exhibition space is limited and will be assigned on a first-come/first-served basis.

Chairs

Kenneth Carter	Devendra Kumar
IBM Almaden Research Center	FSI International
650 Harry Road	47003 Mission Falls Court
San Jose, CA 95120-6099	Fremont, CA 94539
kcarter@almaden.ibm.com	devendra.kumar@fsi-intl.com

Accommodations

The Embassy Suites on the Monterey Bay is located near the heart of Monterey. It is minutes from historic Monterey's Cannery row and the Monterey Aquarium. Monterey is approximately 90 miles south of San Francisco, an hour away from San Jose, CA. Monterey is also serviced by its own international airport with service to many major cities. Rental cars and bus transportation are available. Room rates are $129 ($149 double).

Attendees should make room reservations directly with the hotel by phone at 1-800-EMBASSY or 831-393-1115. You may fax your hotel registration information to 831-393-1113. Hotel rooms are limited and early registration is recommended before August 31, 1999. Failure to register with the hotel prior to that date may result in unavailability of rooms in the conference hotel. To secure the proper rate, please reference the Polymer Division of the American Chemical Society when making your reservation.

Registration

Registration Fee(s)

	Before October 14, 1999	After October 14, 1999
Member of the Division of Polymer Chemistry	US$ 550	US$ 600
Non-Member	US$ 600	US$ 650
Student Member	US$ 250	US$ 300
Student Non-Member	US$ 300	US$ 350
Non-Participating Guest	US$ 200	US$ 250

In addition to handout material, the fee includes meals, receptions, breaks, and a dinner as listed in the brochure.

Cancellation & Refund Policy
Written cancellation or registration after October 14, 1999, will cost an additional $50.

The way to register is to use the form is below......send the completed Registration form below with remittance to:

Neta L. Byerly
Division of Polymer Chemistry, Inc., Virginia Tech
410 Davidson Hall, M.C. 0279
Blacksburg, VA 24061
Phone: 540-231-3029
e-mail: nbyerly@vt.edu.

Prof. Dr. Mr. Ms. Mrs. Miss
Name:____________________
Organization:____________________
Mailing Address:__________________
City: ___________State:___Zip:_________
Country:_________________
Phone:______________Fax:______________
$550 Member Registration
$600 Non-Member Registration
$250 Member Student Registration
$300 Non-Member Student Registration
$200 Accompanying Guest
Name:_____________________
$50 Late Fee (after September 24, 1999)
Total Amount Due: $_________
Payment by:______Check______Credit Card
VISA or MASTER CARD Exp. Date:__________
Account #:______________________
Signature:______________________

____Yes, I plan to contribute a poster
Title:______________________
Author:____________________

Programs

The workshop will consist of a number of high quality lectures and panel discussions.

Sunday, November 14, 1999

6:00 pm	REGISTRATION AND RECEPTION
7:00 pm	Planary Lacture, Robert Havemann, Texas Instruments/SEMATECH	"Process Integration Challenges for Copper and Low k Dielectrics"

Monday, November 15, 1999

7:30 am	CONTINENTAL BREAKFAST
Session I
8:15 am	Carly Case, Lucent Technology Bell Laboratories	"The Evolution of Low k Dielectrics"
9:15 am	Nigel Hacker, AlliedSignal	"Three Spin-on Platforms that will define the Low k through Ultra Low k Dielectric Technologies: Organic, Inorganic and Hybrid Organic/Inorganic Polymers"
10:15 am	BREAK
10:30 am	Farhad Mugdham, Applied Materials	"Inorganic Low k CVD Solutions for < 0.13 mm Technology"
11:30 am	Y. Matsubara, NEC Japan	"Multilevel Interconnect Technology Using Low k a-C:F Films"
12:30 pm	LUNCH
Session II
2:00 pm	L. M. Robeson, Air Products and Chemicals and Schumaker	"Nanoprous Polymers for Low k Interlayer Dielectric Applications"
3:00 pm	John Hummel, IBM Corporation	"Advanced Low k Integration Challenges"
4:00 pm	Jeff Wetzel, Motorola and Gary Ray, Hewlett and Packerd	"Issues in Low k Development and Integration for Interconnect Technology"

Tuesday, November 16, 1999

7:30 am	CONTINENTAL BREAKFAST
Session III
8:15 am	Atsushi Shiota, JSR Microelectronics	"Low Density Low k Dielectrics with e 2.7 to 1.7
9:00 am	Devendra Kumar, FSI International	"Low k Dielectrics Processing: Flexible Solutions for < 0.13 mm Interconnect"
10:00 am	BREAK
10:15 am	Asish Asthana, Lam Research	"Etching of Low k Dielectrics"
10:50 am	Eric S. Moyer, Dow Corning	"Ultra Low k Silsesquioxane Based Dielectrics"
11:30 am	Max Biberger, Novellus Systems	"Integration of FSG and CORAL Low k Dielectrics with Metals"
12:30 pm	LUNCH AND POSTER SESSION
Session IV
2:00 pm	Reiner Dauskardt, Stanford University	"Adhesion and Reliability of New Low k Dielectric Materials"
3:00 pm	Dorel Toma, TEL	"Trends in Ultra Low k Materials¹ Technologies and Related Tools"
4:00 pm	BREAK
4:15 pm	Willi Volksen, IBM Corporation	"Preintegrations Studies of Nanoporous Dielectrics Derived from Inorganic/Organic Hybrid Materials"
5:30 pm	SOCIAL HOUR AND POSTER SESSION
6:30 pm	BANQUET
8:00 pm	Micheal Schen, NIST	TBA

Wednesday, November 17, 1999