POLY Division:

- Call for Papers -

Polymer Materials and Processing for MEMs Technology

Upcoming American Chemical Society (ACS) Symposium

2003 Fall National ACS Meeting

New York, New York, USA

September 7-12, 2003

OVERVIEW: The material of choice for microelectrical mechanical systems (MEMs) has
long been silicon, and the microfabrication techniques have been borrowed from the
microelectronics industry. However, many exciting MEMs applications are requiring
a far more diverse set of materials and processing, and MEMs R&D has now tapped
into the wealth of materials and processing available in the polymer industry.
Polymers are being incorporated into a wide variety of MEMs devices to provide
improved material properties, biocompatibility, flexibility, transparency, larger
surface area, selected electrical properties, ease of processing, and lower cost
to produce. In addition to their traditional uses in microfabrication as
photoresists, adhesives, and packaging, polymers can now be found in MEMs
technology as structural components, membrane actuators, microlens, microfluidic
valves and substrates, high surface area sensors and preconcentrators,
microfilters, conductive composites, and complex 3-D microstructures.

TOPICS OF INTEREST: The symposium will focus on polymer materials and processing
that are enabling for microfabrication and functioning of a MEMs device including
the following areas:

Polymeric microfluidic components (e.g. substrates, valves, pump, membranes)
Refractive microptical components (e.g. microlens, soft lens, waveguides, beam
splitters) High performance polymers for microsensors, preconcentrators, or
molecular filters Flexible MEMs using polymeric materials
High aspect ratio or complex 3-D polymeric structural components for MEMs
Specialty polymers and polymeric coatings for biocompatible MEMs Polymers and
processing for soft lithography and advanced lithographic techniques Polymeric
precursors for ceramics and non-Si structures in MEMs devices Polymer processing
for MEMs including:

a. Surface and bulk micromaching of polymers b. Soft lithography,
photopolymerization, and micro stereolithography c. Micro injection molding or
microcasting d. Polymer bonding and other multi-layer processing techniques

ABSTRACT AND PRE-PRINT SUBMISSION: Both an abstract (about 150 words) and a pre-
print (1-2 pages with figures and graphics) are required by MAY 2, 2003. Both oral
and poster presentations are being solicited. To participate in this symposium,
please submit an abstract via the ACS online abstract submission system OASys at
<http://oasys.acs.org/acs/226nm/poly/papers/index.cgi>http://oasys.acs.org/acs/226
nm/poly/papers/index.cgi or contact the symposium organizer below.

The electronic preprint should be prepared as a word processing document using the
POLY2002 Preprint Template available on the division's home page
(<http://www.chem.umr.edu/~poly/preprints.online.html>http://www.chem.umr.edu/~pol
y/preprints.online.html). The preprint is also submitted through OASys using the
record number issued to the paper at the time of the abstract submission. The
submitted preprint will be automatically converted into PDF format and made
viewable by the authors. Until the preprint submission close date (May 2, 2003),
the authors may re-transmit as many revised drafts as necessary until the PDF
document conforms to the required preprint format. After preprint submission close
date, the PDF file will be reviewed online by the Symposium organizer. Upon
approval by the organizer, the preprint file will be forwarded to the preprint
editors for final acceptance.

SYMPOSIUM ORGANIZER: FURTHER INFORMATION:
Craig C.
Henderson                                                                        
                    <http://www.polyacs.org>http://www.polyacs.org

Sandia National Laboratories
Livermore, CA 94550
<mailto:cchende@sandia.gov>cchende@sandia.gov 925-294-3628 (FAX: 294-3870)